Wafer soft (hard) engraving machine

Focused on the industry for 8 years, Denai Laser focuses on expertise

The laser acts on the wafer, instantly ablating and vaporizing it through a thermal light source or breaking the molecular bonds of the material through a cold light source, leaving corresponding characters, text, or patterns on the wafer surface. Wafer marking features automatic loading and unloading, automatic positioning, and automatic marking functions.

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Porducts

Plastic laser welding machine

- Trajectory laser welding plastic machine - Quasi synchronous laser welding plastic machine - Deep penetration laser plastic welding equipment - Cylindrical plastic laser welding machine - Laser axial plastic welding machine - Transparent material plastic welding machine - Synchronous plastic laser welding machine - Bumper laser cutting and welding integrated machine
Laser engraving machine

- Production Line Marking Machine - Metal laser marking machine - Non-metallic laser marking machine - UV laser marking machine - Picosecond laser marker - Three-dimensional laser engraving machine - Wafer soft (hard) engraving machine
Full-field laser cleaning machine

- Platform laser cleaning machine - Handheld laser cleaning machine
Precision laser cutting machine

- Gate laser cutting machine - Fine laser cutting machine - Dumbbell laser engraving machine - Polymer Material Laser Cutting Machine (SMC) - Five axis laser cutting machine

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Product Overview

The laser acts on the wafer, instantly thermally ablating and vaporizing it through a thermal light source or breaking the molecular bonds of the material through a cold light source, leaving corresponding characters, text, or patterns on the wafer surface. Wafer marking features automatic loading and unloading, automatic positioning, and automatic marking functions.

Features of the equipment

◆CCD automatic precise positioning;

◆ Automatic film retrieval and placement by robotic arm;

◆ Both the front and back sides can be marked;

◆ Professional dust removal system;

◆ Automatic counting;

◆ Automatic film jumping in case of empty material. (Optional)

◆Number of cards (optional)

Product parameters

Name	parameter value

Marking format	Hard marking	Soft marking
ay	100W	20W
Marking depth(mm)	3.-60um	2-5um
Marking speed(mm/s)	≤7000mm
Wafer processing dimensions	2”-12”
Position accuracy	±0.1mm
font standard	SEMI
Industrial gas source(L/min)	0.6
Capacity cycle	≥100片/H
Machine power(KVA)	2.5KW	1.5KW
Dust removal standards	0.3μm particle